NSR0115CQP6T5G Datasheet, PDF (1/4 Pages) ON Semiconductor – Common Cathode Schottky Diodes

NSR0115CQP6T5G
Two Dual 15 V, 0.1 A
Common Cathode Schottky
Diodes
These Schottky barrier diodes are designed for high speed switching
applications, circuit protection, and voltage clamping. Extremely low
forward voltage reduces conduction loss. Industry leading smallest
surface mount package is excellent for hand−held and portable
applications where space is limited.
Features
• Extremely Fast Switching Speed
• Low Forward Voltage − 0.4 V (Max) @ I_F = 10 mA
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
• Portable Devices (Digital Cameras, MP3 Players … etc)
• Mobile Phones
• Keyboards
• Low Voltage Motor Control (Disc Drives)
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Reverse Voltage
Forward Current (DC)
Repetitive Peak Forward Current
Non−Repetitive Peak Forward
Current (t < 1.0 s)
V_R
I_F
I_FRM
I_FSM
15
V
100
mA
0.3
A
2.0
A
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Rating
Symbol
Max
Unit
Total Device Dissipation
T_A = 25°C
Derate above 25°C
P_D
(Note 1)
260
mW
2.1
mW/°C
Thermal Resistance,
Junction to Ambient
R_qJA
480
°C/W
(Note 1)
Total Device Dissipation
T_A = 25°C
Derate above 25°C
P_D
(Note 2)
360
mW
2.9
mW/°C
Thermal Resistance, Junction to
Ambient
R_qJA
347
°C/W
(Note 2)
Junction and Storage Temperature
T_J, T_stg
−55 to
°C
Range
+150
1. FR−4 @ 10 mm², 1 oz. copper trace, still air.
2. FR−4 @ 100 mm², 1 oz. copper trace, still air.
http://onsemi.com
MARKING
DIAGRAM
SOT−963
CASE 527AD
XM M
1
XM = Specific Device Code
M
= Month Code
PIN CONFIGURATION
Pin 4
Pin 5
Pin 6
Pin 3
Pin 2
Pin 1
ORDERING INFORMATION
Device
Package
NSR0115CQP6T5G SOT−963
(Pb−Free)
Shipping
8000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
1
August, 2013 − Rev. 0
Publication Order Number:
NSR0115CQP6/D