NCP1631 Datasheet, PDF (1/23 Pages) ON Semiconductor – Interleaved, 2-Phase Power Factor Controller

NCP1631
Interleaved, 2-Phase Power
Factor Controller
The NCP1631 integrates a dual MOSFET driver for interleaved
PFC applications. Interleaving consists of paralleling two small
stages in lieu of a bigger one, more difficult to design. This approach
has several merits like the ease of implementation, the use of smaller
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components or a better distribution of the heating.
Also, Interleaving extends the power range of Critical Conduction
MARKING DIAGRAM
Mode that is an efficient and cost−effective technique (no need for
low t_rr diodes). In addition, the NCP1631 drivers are 180° phase shift
for a significantly reduced current ripple.
Housed in a SOIC16 package, the circuit incorporates all the
features necessary for building robust and compact interleaved PFC
stages, with a minimum of external components.
General Features
• Near−Unity Power Factor
• Substantial 180° Phase Shift in All Conditions Including Transient
Phases
SOIC−16
D SUFFIX
CASE 751B
A
WL
Y
WW
G
NCP1631G
AWLYWWG
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
PIN ASSIGNMENT
• Frequency Clamped Critical Conduction Mode (FCCrM) i.e.,
Fixed Frequency, Discontinuous Conduction Mode Operation with
ZCD2
1
FB
ZCD1
REF5V/pfcOK
Critical Conduction Achievable in Most Stressful Conditions
Rt
DRV1
• FCCrM Operation Optimizes the PFC Stage Efficiency Over the
OSC
GND
Load Range
Vcontrol
Vcc
• Out−of−phase Control for Low EMI and a Reduced rms Current in
FFOLD
DRV2
the Bulk Capacitor
BO
Latch
• Frequency Fold−back at Low Power to Further Improve the Light
OVP / UVP
CS
Load Efficiency
(Top View)
• Accurate Zero Current Detection by Auxiliary Winding for Valley
Turn On
• Fast Line / Load Transient Compensation
ORDERING INFORMATION
Device
Package
Shipping^†
• High Drive Capability: −500 mA / +800 mA
• Signal to Indicate that the PFC is Ready for Operation (“pfcOK”
Pin)
• V_CC Range: from 10 V to 20 V
NCP1631DR2G SOIC−16 2500 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Safety Features
Typical Applications
• Output Over and Under Voltage Protection
• Computer Power Supplies
• Brown−Out Detection with a 50−ms Delay to Help
• LCD / Plasma Flat Panels
Meet Hold−up Time Specifications
• Soft−Start for Smooth Start−up Operation
• All Off Line Appliances Requiring Power Factor
Correction
• Programmable Adjustment of the Maximum Power
• Over Current Limitation
• Detection of Inrush Currents
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2009
1
August, 2009 − Rev. 0
Publication Order Number:
NCP1631/D