MURA260T3G_12 Datasheet, PDF (1/5 Pages) ON Semiconductor – Surface Mount Ultrafast Power Rectifier

MURA260T3G,
SURA8260T3G
Preferred Device
Surface Mount
Ultrafast Power Rectifier
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
Features
 Small Compact Surface Mountable Package with J−Bend Leads
 Rectangular Package for Automated Handling
 High Temperature Glass Passivated Junction
 Low Forward Voltage Drop (1.2 V Max @ 2.0 A, T_J = 150C)
 AEC−Q101 Qualified and PPAP Capable
 SURA8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
 All Packages are Pb-Free*
Mechanical Characteristics:
 Case: Epoxy, Molded
 Weight: 70 mg (Approximately)
 Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
 Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
 Polarity: Polarity Band Indicates Cathode Lead
 ESD Protection:
 Human Body Model > 4000 V (Class 3)
 Machine Model > 400 V (Class C)
http://onsemi.com
ULTRAFAST RECTIFIER
2 AMPERES, 600 VOLTS
SMA
CASE 403D
PLASTIC
MARKING DIAGRAM
U5J
AYWW G
U5J = Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
ORDERING INFORMATION
Device
MURA260T3G
SURA8260T3G
Package
Shipping^†
SMA 5,000/Tape & Reel
(Pb−Free)
SMA 5,000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
1
January, 2012 − Rev. 4
Publication Order Number:
MURA260T3/D