MMVL3401T1G Datasheet, PDF (1/3 Pages) ON Semiconductor – Silicon Pin Diode

MMVL3401T1G
Silicon Pin Diode
This device is designed primarily for VHF band switching
applications but is also suitable for use in general−purpose switching
circuits. Supplied in a Surface Mount package.
Features
• Rugged PIN Structure Coupled with Wirebond Construction
for Optimum Reliability
• Low Capacitance: 0.7 pF Typ at V_R = 20 Vdc
• Very Low Series Resistance at 100 MHz:
0.34 W (Typ) @ I_F = 10 mAdc
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Symbol Value Unit
Continuous Reverse Voltage
Peak Forward Current
THERMAL CHARACTERISTICS
V_R
35
Vdc
I_F
20 mAdc
Characteristic
Symbol Max Unit
Total Device Dissipation FR5 Board,
T_A = 25°C (Note 1)
Derate above 25°C
P_D
200 mW
1.57 mW/°C
Thermal Resistance Junction−to−Ambient
R_qJA
635 °C/W
Junction and Storage Temperature
T_J, T_stg 150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR4 Minimum Pad
http://onsemi.com
SILICON PIN SWITCHING DIODE
1
CATHODE
2
ANODE
2
1
SOD−323
CASE 477
STYLE 1
MARKING DIAGRAM
4D M G
G
4D = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
MMVL3401T1G SOD−323 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2010
1
September, 2010 − Rev. 4
Publication Order Number:
MMVL3401T1/D