MMDL914T1G_11 Datasheet, PDF (1/4 Pages) ON Semiconductor – High-Speed Switching Diode

MMDL914T1G,
SMMDL914T1G,
MMDL914T3G
High-Speed Switching
Diode
Features
 AEC−Q101 Qualified and PPAP Capable
 S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
 These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Reverse Voltage
V_R
100
V
Forward Current
I_F
200
mA
Peak Forward Surge Current
I_FM(surge)
500
mA
Non−Repetitive Peak Forward Current
I_FM
A
t = 1.0 ms
4.0
t = 1.0 s
2.0
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR-5 Board
P_D
T_A = 25C (Note 1)
Derate above 25C
200
mW
1.57
mW/C
Thermal Resistance,
Junction−to−Ambient
R_qJA
C/W
635
Junction and Storage Temperature
T_J, T_stg −55 to 150
C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR-4 Minimum Pad.
http://onsemi.com
SOD−323
CASE 477
STYLE 1
1
CATHODE
2
ANODE
MARKING DIAGRAM
5D M G
G
5D = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MMDL914T1G
SMMDL914T1G
MMDL914T3G
Package
SOD−323
(Pb−Free)
SOD−323
(Pb−Free)
SOD−323
(Pb−Free)
Shipping^†
3,000 /
Tape & Reel
3,000 /
Tape & Reel
10,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2011
1
November, 2011 − Rev. 7
Publication Order Number:
MMDL914T1/D