MMDF6N03HDR2 Datasheet, PDF (1/10 Pages) ON Semiconductor – Power MOSFET 6 Amps, 30 Volts

MMDF6N03HD
Preferred Device
Power MOSFET
6 Amps, 30 Volts
N−Channel SO−8, Dual
These miniature surface mount MOSFETs feature low R_DS(on) and
true logic level performance. Dual MOSFET devices are designed for
use in low voltage, high speed switching applications where power
efficiency is important. Typical applications are dc−dc converters, and
power management in portable and battery powered products such as
computers, printers, cellular and cordless phones. They can also be
used for low voltage motor controls in mass storage products such as
disk drives and tape drives.
• Low R_DS(on) Provides Higher Efficiency and Extends Battery Life
• Logic Level Gate Drive − Can Be Driven by Logic ICs
• Miniature SO−8 Surface Mount Package − Saves Board Space
• Diode Is Characterized for Use In Bridge Circuits
• Diode Exhibits High Speed, With Soft Recovery
• I_DSS Specified at Elevated Temperature
• Mounting Information for SO−8 Package Provided
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Drain Current − Continuous @ T_A = 25°C
Drain Current − Single Pulse (t_p ≤ 10 μs)
Source Current − Continuous @ T_A = 25°C
Total Power Dissipation @ T_A = 25°C
(Note 1.)
V_DSS
V_GS
I_D
I_DM
I_S
P_D
30
Vdc
± 20 Vdc
6.0
Adc
30
Apk
1.7
Adc
2.0 Watts
Operating and Storage Temperature Range T_J, T_stg − 55 to °C
150
Single Pulse Drain−to−Source Avalanche
Energy − Starting T_J = 25°C
(V_DD = 30 Vdc, V_GS = 5.0 Vdc,
V_DS = 20 Vdc, I_L = 9.0 Apk,
L = 10 mH, R_G = 25 W)
Thermal Resistance − Junction−to−Ambient
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from Case for 10 sec.
E_AS
R_θJA
T_L
325
mJ
62.5 °C/W
260
°C
1. Mounted on G10/FR4 glass epoxy board using minimum recommended
footprint.
http://onsemi.com
6 AMPERES
30 VOLTS
R_DS(on) = 35 mW
N−Channel
D
D
G
G
S
S
MARKING
DIAGRAM
8
SO−8, Dual
CASE 751
STYLE 11
D6N03
LYWW
1
D6N03
L
Y
WW
= Device Code
= Location Code
= Year
= Work Week
PIN ASSIGNMENT
Source−1
Gate−1
Source−2
Gate−2
18
27
36
45
Top View
Drain−1
Drain−1
Drain−2
Drain−2
ORDERING INFORMATION
Device
Package
Shipping
MMDF6N03HDR2 SO−8 2500 Tape & Reel
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2006
1
August, 2006 − Rev. 4
Publication Order Number:
MMDF6N03HD/D