MMDF3N04HD Datasheet, PDF (1/12 Pages) Motorola, Inc – DUAL TMOS POWER MOSFET 3.4 AMPERES 40 VOLTS

MMDF3N04HD
Preferred Device
Power MOSFET
3 Amps, 40 Volts
N−Channel SO−8, Dual
These miniature surface mount MOSFETs feature ultra low R_DS(on) and
true logic level performance. They are capable of withstanding high energy
in the avalanche and commutation modes and the drain−to−source diode
has a very low reverse recovery time. MiniMOS™ devices are designed
for use in low voltage, high speed switching applications where power
efficiency is important. Typical applications are dc−dc converters, and
power management in portable and battery powered products such as
computers, printers, cellular and cordless phones. They can also be used for
low voltage motor controls in mass storage products such as disk drives
and tape drives. The avalanche energy is specified to eliminate the
guesswork in designs where inductive loads are switched and offer
additional safety margin against unexpected voltage transients.
• Ultra Low R_DS(on) Provides Higher Efficiency and Extends Battery
Life
• Logic Level Gate Drive − Can Be Driven by Logic ICs
• Miniature SO−8 Surface Mount Package − Saves Board Space
• Diode Is Characterized for Use In Bridge Circuits
• Diode Exhibits High Speed, With Soft Recovery
• I_DSS Specified at Elevated Temperature
• Mounting Information for SO−8 Package Provided
• Avalanche Energy Specified
N−Channel
D
G
S
http://onsemi.com
V_(BR)DSS
40 V
8
1
R_DS(on) TYP
80 mW @ TBD
I_D MAX
3.0 A
MARKING
DIAGRAM
SO−8, Dual
CASE 751
Style 11
D3N04H
ALYW
D3N04H = Specific Device Code
A
= Assembly Location
L
=Wafer Lot
Y
= Year
W
= Work Week
PIN ASSIGNMENT
Source−1
Gate−1
Source−2
Gate−2
18
27
36
45
Top View
Drain−1
Drain−1
Drain−2
Drain−2
ORDERING INFORMATION
Device
Package
Shipping^†
MMDF3N04HDR2 SO−8 2500 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2003
1
October, 2003 − Rev. 3
Publication Order Number:
MMDF3N04HD/D