MMBD352WT1G Datasheet, PDF (1/3 Pages) ON Semiconductor – Dual Schottky Barrier Diode

MMBD352WT1G,
NSVMMBD352WT1G
Dual Schottky Barrier Diode
These devices are designed primarily for UHF mixer applications
but are suitable also for use in detector and ultra−fast switching
circuits.
Features
 Very Low Capacitance − Less Than 1.0 pF @ 0 V
 Low Forward Voltage − 0.5 V (Typ) @ I_F = 10 mA
 AEC Qualified and PPAP Capable
 NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
 These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Continuous Reverse Voltage
V_R
7.0
V_CC
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR− 5 Board
P_D
(Note 1)
T_A = 25C
Derate above 25C
200
mW
1.6
mW/C
Thermal Resistance,
Junction−to−Ambient
R_qJA
625
C/W
Total Device Dissipation Alumina
Substrate (Note 2)
T_A = 25C
Derate above 25C
P_D
300
mW
2.4
mW/C
Thermal Resistance,
Junction−to−Ambient
R_qJA
C/W
417
Junction and Storage Temperature
T_J, T_stg − 55 to +150
C
1. FR−5 = 1.0  0.75  0.062 in.
2. Alumina = 0.4  0.3  0.024 in. 99.5% alumina.
http://onsemi.com
SOT−323 (SC−70)
CASE 419
STYLE 9
1
ANODE
3
CATHODE/ANODE
2
CATHODE
MARKING DIAGRAM
M5 MG
G
1
M5
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package Shipping^†
MMBD352WT1G
SOT−323
3,000 /
(Pb−Free) Tape & Reel
NSVMMBD352WT1G SOT−323
3,000 /
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2011
1
November, 2011 − Rev. 5
Publication Order Number:
MMBD352WT1/D