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MJF122 Datasheet, PDF (1/7 Pages) ON Semiconductor – COMPLEMENTARY SILICON POWER DARLINGTONS 5.0 A, 100 V, 30 W | |||
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MJF122, MJF127
Complementary Power
Darlingtons
For Isolated Package Applications
Designed for generalâpurpose amplifiers and switching
applications, where the mounting surface of the device is required to
be electrically isolated from the heatsink or chassis.
Features
⢠Electrically Similar to the Popular TIP122 and TIP127
⢠100 VCEO(sus)
⢠5.0 A Rated Collector Current
⢠No Isolating Washers Required
⢠Reduced System Cost
⢠High DC Current Gain â 2000 (Min) @ IC = 3 Adc
⢠UL Recognized, File #E69369, to 3500 VRMS Isolation
⢠PbâFree Packages are Available*
MAXIMUM RATINGS
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Rating
Symbol Value
Unit
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ CollectorâEmitter Voltage
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ CollectorâBase Voltage
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ EmitterâBase Voltage
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ RMS Isolation Voltage (Note 1) Test No. 1
Per Figure 14 (for 1 sec, R.H. < 30%,
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Test No. 2 Per Figure 15 TA = 25_C)
Test No. 3 Per Figure 16
VCEO
VCB
VEB
VISOL
100
100
5
4500
3500
1500
Vdc
Vdc
Vdc
VRMS
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Collector Current â Continuous
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Peak
IC
5
Adc
8
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Base Current
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Total Power Dissipation (Note 2)
@ TC = 25_C
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Derate above 25_C
IB
0.12
Adc
PD
30
W
0.24
W/_C
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Total Power Dissipation @ TA = 25_C
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Derate above 25_C
PD
2
W
0.016 W/_C
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Operating and Storage Junction Tempera- TJ, Tstg â65 to
IC
ture Range
+ 150
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ THERMAL CHARACTERISTICS
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Characteristic
Symbol Max
Unit
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Thermal Resistance, JunctionâtoâAmbient
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Thermal Resistance, JunctionâtoâCase
(Note 2)
RqJA
RqJC
62.5
_C/W
4.1
_C/W
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Lead Temperature for Soldering Purpose
TL
260
_C
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Maximum ratings are those values beyond which device damage can occur.
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Proper strike and creepage distance must be provided.
2. Measurement made with thermocouple contacting the bottom insulated
mounting surface (in a location beneath the die), the device mounted on a
heatsink with thermal grease and a mounting torque of ⥠6 in. lbs.
© Semiconductor Components Industries, LLC, 2006
1
April, 2006 â Rev. 5
http://onsemi.com
COMPLEMENTARY SILICON
POWER DARLINGTONS
5.0 A, 100 V, 30 W
MARKING
DIAGRAM
TOâ220
CASE 221Dâ02
STYLE 2
MJF12xG
AYWW
x
= 2 or 7
G
= PbâFree Package
A
= Assembly Location
Y
= Year
WW
= Work Week
ORDERING INFORMATION
Device
MJF122
Package
TOâ220
Shippingâ
50 Units / Rail
MJF122G
TOâ220
(PbâFree)
50 Units / Rail
MJF127
TOâ220
50 Units / Rail
MJF127G
TOâ220
(PbâFree)
50 Units / Rail
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our PbâFree strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
Publication Order Number:
MJF122/D
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