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MJD112_06 Datasheet, PDF (1/8 Pages) ON Semiconductor – Complementary Darlington Power Transistors | |||
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MJD112 (NPN)
MJD117 (PNP)
Preferred Device
Complementary Darlington
Power Transistors
DPAK For Surface Mount Applications
Designed for general purpose power and switching such as output or
driver stages in applications such as switching regulators, converters,
and power amplifiers.
Features
⢠Lead Formed for Surface Mount Applications in Plastic Sleeves
(No Suffix)
⢠Straight Lead Version in Plastic Sleeves (ââ1â Suffix)
⢠Electrically Similar to Popular TIP31 and TIP32 Series
⢠PbâFree Packages are Available
MAXIMUM RATINGS
Rating
CollectorâEmitter Voltage
CollectorâBase Voltage
EmitterâBase Voltage
Collector Current â Continuous
â Peak
Base Current
Total Power Dissipation @ TC = 25°C
Derate above 25°C
Total Power Dissipation (Note1)
@ TA = 25°C
Derate above 25°C
Operating and Storage Junction
Temperature Range
Symbol
VCEO
VCB
VEB
IC
Max
100
100
5
2
4
Unit
Vdc
Vdc
Vdc
Adc
IB
50
mAdc
PD
20
W
0.16
W/°C
PD
W
1.75
W/°C
0.014
TJ, Tstg â65 to +150 °C
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance, JunctionâtoâCase
Thermal Resistance, JunctionâtoâAmbient
(Note 1)
RqJC
RqJA
6.25
°C/W
71.4
°C/W
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. These ratings are applicable when surface mounted on the minimum pad
sizes recommended.
http://onsemi.com
SILICON
POWER TRANSISTORS
2 AMPERES
100 VOLTS, 20 WATTS
12
3
4
DPAK
CASE 369C
MARKING
DIAGRAMS
YWW
J11xG
4
1
2
3
DPAKâ3
CASE 369D
YWW
J11xG
Y
= Year
WW
= Work Week
x
= 2 or 7
G
= PbâFree Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2006
1
January, 2006 â Rev. 7
Publication Order Number:
MJD112/D
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