MC74LCX541_14 Datasheet, PDF (1/8 Pages) ON Semiconductor – Low-Voltage CMOS Octal Buffer Flow Through Pinout

MC74LCX541
Low-Voltage CMOS Octal
Buffer Flow Through Pinout
With 5 V−Tolerant Inputs and Outputs
(3−State, Non−Inverting)
The MC74LCX541 is a high performance, non−inverting octal
buffer operating from a 2.3 to 3.6 V supply. This device is similar in
function to the MC74LCX244, while providing flow through
architecture. High impedance TTL compatible inputs significantly
reduce current loading to input drivers while TTL compatible outputs
offer improved switching noise performance. A V_I specification of
5.5 V allows MC74LCX541 inputs to be safely driven from 5 V
devices. The MC74LCX541 is suitable for memory address driving
and all TTL level bus oriented transceiver applications.
Current drive capability is 24 mA at the outputs. The Output Enable
(OE1. OE2) inputs, when HIGH, disables the output by placing them
in a HIGH Z condition.
Features
• Designed for 2.3 to 3.6 V V_CC Operation
• 5 V Tolerant − Interface Capability With 5 V TTL Logic
• Supports Live Insertion and Withdrawal
• I_OFF Specification Guarantees High Impedance When V_CC = 0 V
• LVTTL Compatible
• LVCMOS Compatible
• 24 mA Balanced Output Sink and Source Capability
• Near Zero Static Supply Current in All Three Logic States (10 mA)
Substantially Reduces System Power Requirements
• Latchup Performance Exceeds 500 mA
• ESD Performance:
♦ Human Body Model > 2000 V
♦ Machine Model > 200 V
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
http://onsemi.com
SOIC−20 WB
DW SUFFIX
CASE 751D
TSSOP−20
DT SUFFIX
CASE 948E
MARKING DIAGRAMS
20
LCX541
AWLYYWWG
1
SOIC−20 WB
20
LCX
541
ALYW G
G
1
TSSOP−20
A
=
L, WL =
Y, YY =
W, WW =
G or G =
Assembly Location
Wafer Lot
Year
Work Week
Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
August, 2014 − Rev. 9
Publication Order Number:
MC74LCX541/D