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MBT3904DW1 Datasheet, PDF (1/8 Pages) ON Semiconductor – Dual General Purpose Transistors
MBT3904DW1,
MBT3904DW2,
SMBT3904DW1,
NSVMBT3904DW1
Dual General Purpose
Transistors
The MBT3904DW1 and MBT3904DW2 devices are a spin−off of
our popular SOT−23/SOT−323 three−leaded device. It is designed for
general purpose amplifier applications and is housed in the SOT−363
six−leaded surface mount package. By putting two discrete devices in
one package, this device is ideal for low−power surface mount
applications where board space is at a premium.
Features
• hFE, 100−300
• Low VCE(sat), ≤ 0.4 V
• Simplifies Circuit Design
• Reduces Board Space
• Reduces Component Count
• Available in 8 mm, 7−inch/3,000 Unit Tape and Reel
• S and NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector −Emitter Voltage
Collector −Base Voltage
Emitter −Base Voltage
Collector Current − Continuous
Electrostatic Discharge
VCEO
VCBO
VEBO
IC
ESD
40
Vdc
60
Vdc
6.0
Vdc
200
mAdc
HBM Class 2
MM Class B
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Package Dissipation (Note 1)
TA = 25°C
Thermal Resistance,
Junction−to−Ambient
PD
RqJA
150
mW
833
°C/W
Junction and Storage
Temperature Range
TJ, Tstg − 55 to +150 °C
1. Device mounted on FR4 glass epoxy printed circuit board using the minimum
recommended footprint.
www.onsemi.com
MARKING
DIAGRAM
6
6
SOT−363/SC−88/
SC70−6
CASE 419B
XX MG
G
1
1
XX = MA for MBT3904DW1T1G
MJ for MBT3904DW2T1G
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
(3)
(2)
(1)
Q1
Q2
(4)
(5)
(6)
MBT3904DW1T1
STYLE 1
(3)
(2)
(1)
Q2
Q1
(4)
(5)
(6)
MBT3904DW2T1
STYLE 27
ORDERING INFORMATION
Device
Package Shipping†
MBT3904DW1T1G,
MBT3904DW2T1G
SOT−363
3000 /
(Pb−Free) Tape & Reel
SMBT3904DW1T1G
SOT−363
3000 /
(Pb−Free) Tape & Reel
NSVMBT3904DW1T3G SOT−363 10000 /
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
1
June, 2015 − Rev. 11
Publication Order Number:
MBT3904DW1T1/D