MBRS3100T3G_16 Datasheet, PDF (1/4 Pages) ON Semiconductor – Surface Mount Schottky Power Rectifier

MBRS3100T3G,
NRVBS3100T3G
Surface Mount
Schottky Power Rectifier
This device employs the Schottky Barrier principle in a large area
metal−to−silicon power diode. State−of−the−art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity protection diodes, in surface mount
applications where compact size and weight are critical to the system.
Features
 Small Compact Surface Mountable Package with J−Bend Leads
 Rectangular Package for Automated Handling
 Highly Stable Oxide Passivated Junction
 Excellent Ability to Withstand Reverse Avalanche Energy Transients
 Guard−Ring for Stress Protection
 AEC−Q101 Qualified and PPAP Capable
 NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
 All Packages are Pb−Free*
Mechanical Characteristics
 Case: Epoxy, Molded
 Weight: 217 mg (Approximately)
 Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
 Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
 Polarity: Notch in Plastic Body Indicates Cathode Lead
 ESD Ratings:
 Machine Model = C
 Human Body Model = 3B
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIERS
3.0 AMPERES, 100 VOLTS
SMC
CASE 403
MARKING DIAGRAM
AYWW
B310G
G
B310
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
MBRS3100T3G
SMC
(Pb−Free)
2,500 /
Tape & Reel
NRVBS3100T3G
SMC
(Pb−Free)
2,500 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
1
January, 2012 − Rev. 4
Publication Order Number:
MBRS3100T3/D