MBRS230LT3_05 Datasheet, PDF (1/4 Pages) ON Semiconductor – Surface Mount Schottky Power Rectifier

MBRS230LT3
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
This device employs the Schottky Barrier principle in a
metal−to−silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
Features
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Highly Stable Oxide Passivated Junction
• Guardring for Over−Voltage Protection
• Low Forward Voltage Drop
• Pb−Free Package is Available
Mechanical Characteristics
• Case: Molded Epoxy
• Epoxy Meets UL 94, V−0 @ 0.125 in.
• Weight: 95 mg (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Maximum Temperature of 260°C/10 Seconds for Soldering
• Available in 12 mm Tape, 2500 Units per 13″ Reel,
Add “T3” Suffix to Part Number
• Cathode Polarity Band
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
2.0 AMPERES
30 VOLTS
SMB
CASE 403A
PLASTIC
MARKING DIAGRAM
ALYW
2BL3G
G
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
MBRS230LT3
SMB
2500/Tape & Reel
MBRS230LT3G SMB
2500/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
1
April, 2005 − Rev. 3
Publication Order Number:
MBRS230LT3/D