ESDR0524PMUTAG Datasheet, PDF (1/3 Pages) ON Semiconductor – Transient Voltage Suppressors Low Capacitance ESD Protection for High Speed Data

ESDR0524PMUTAG
Transient Voltage
Suppressors
Low Capacitance ESD Protection for
High Speed Data
The ESDR0524P transient voltage suppressor is designed to protect
high speed data lines from ESD. Ultra−low capacitance and low ESD
clamping voltage make this device an ideal solution for protecting
voltage sensitive high speed data lines. The flow−through style
package allows for easy PCB layout and matched trace lengths
necessary to maintain consistent impedance between high speed
differential lines such as HDMI.
Features
• Low Capacitance (0.3 pF Typical, I/O to I/O)
• ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model
and Class C (Exceeding 400 V) per Machine Model
• Protection for the Following IEC Standards:
IEC 61000−4−2 (±8 kV Contact)
• UL Flammability Rating of 94 V−0
• This is a Pb−Free Device
Typical Applications
• HDMI
• DVI
• Display Port
• MDDI
• eSATA
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Operating Junction Temperature Range
T_J
−55 to +125 °C
Storage Temperature Range
T_stg
−55 to +150 °C
Lead Solder Temperature −
Maximum (10 Seconds)
T_L
260
°C
IEC 61000−4−2 Contact (ESD)
IEC 61000−4−2 Air (ESD)
ESD
ESD
±8.0
kV
±15
kV
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
UDFN10
CASE 517BB
MARKING
DIAGRAM
4P MG
G
4P
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONFIGURATION
AND SCHEMATIC
N/C N/C GND N/C N/C
10 9 8 7 6
12 3 4 5
I/O I/O GND I/O I/O
Pin 1 Pin 2
Pin 4 Pin 5
Pin 3,8
ORDERING INFORMATION
Device
Package Shipping
ESDR0524PMUTAG UDFN10
3000 /
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
See Application Note AND8308/D for further description of
survivability specs.
© Semiconductor Components Industries, LLC, 2010
1
July, 2010 − Rev. 1
Publication Order Number:
ESDR0524P/D