ESDM3031 Datasheet, PDF (1/7 Pages) ON Semiconductor – ESD Protection Diode

ESDM3031
ESD Protection Diode
Micro−Packaged Diodes for ESD Protection
The ESDM3031 is designed to protect voltage sensitive components
that require low capacitance from ESD and transient voltage events.
Excellent clamping capability, low capacitance, low leakage, and fast
response time, make these parts ideal for ESD protection on designs
where board space is at a premium.
Features
• Low Clamping Voltage
• Small Body Outline Dimensions: 0.62 mm x 0.32 mm
• Low Body Height: 0.3 mm
• Stand−off Voltage: 3.3 V
• IEC61000−4−2 Level 4 ESD Protection
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
• mSD Card Protection
• Audio Line
• GPIO
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 61000−4−2 (ESD)
Contact
Air
±30
kV
±30
Total Power Dissipation on FR−5 Board
(Note 1) @ T_A = 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
Lead Solder Temperature − Maximum
(10 Second Duration)
°P_D°
R_qJA
T_J, T_stg
T_L
250
mW
400
°C/W
−55 to +150 °C
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
www.onsemi.com
1
2
X3DFN2
CASE 152AF
MARKING
DIAGRAM
PIN 1
M
5 = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device
Package Shipping^†
ESDM3031MXT5G X3DFN2 10000 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2017
1
May, 2017 − Rev. 1
Publication Order Number:
ESDM3031/D