ESD9R3.3S Datasheet, PDF (1/4 Pages) ON Semiconductor – Transient Voltage Suppressors

ESD9R3.3S, SZESD9R3.3S
Transient Voltage
Suppressors
ESD Protection Diodes with Ultra−Low
Leakage
The ESD9R is designed to provide ESD protection for ASSPs and
ASICs used in ultra low current applications such as human body sensors.
These devices have been designed for leakage under 1 nA from 0°C to
50°C when turned off. During an ESD event, these devices turn on to
clamp the ESD to a safe voltage level for the IC. These devices have the
added benefits of low capacitance for high speed data lines and small
package size for space constrained designs.
http://onsemi.com
Specification Features:
• Ultra−Low Leakage < 1 nA
• Ultra−Low Capacitance 0.5 pF
• Low Clamping Voltage
• Small Body Outline Dimensions:
0.039″ x 0.024″ (1.00 mm x 0.60 mm)
• Low Body Height: 0.016″ (0.4 mm)
• Stand−off Voltage: 3.3 V
• Response Time < 1.0 ns
• IEC61000−4−2 Level 4 ESD Protection
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• This is a Pb−Free and Halogen−Free Device
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
SOD−923
CASE 514AB
MARKING DIAGRAM
JM
J = Specific Device Code
M = Date Code
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
ESD9R3.3ST5G
SOD−923
(Pb−Free)
SZESD9R3.3ST5G SOD−923
(Pb−Free)
8000 / Tape &
Reel
8000 / Tape &
Reel
Rating
IEC 61000−4−2 (ESD)
HBM
Contact
Air
Symbol
Value
Unit
±10
kV
±15
±16
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Total Power Dissipation on FR−5 Board
(Note 1) @ T_A = 25°C
Storage Temperature Range
Junction Temperature Range
Lead Solder Temperature − Maximum
(10 Second Duration)
°P_D°
T_stg
T_J
T_L
150
mW
−55 to +150 °C
−55 to +125 °C
260
°C
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 2 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2013
1
May, 2013 − Rev. 1
Publication Order Number:
ESD9R3.3S/D