CM1442-06LP Datasheet, PDF (1/10 Pages) ON Semiconductor – LCD and Camera EMI Filter Array with ESD Protection

LCD and Camera EMI Filter Array
with ESD Protection
CM1442-06LP
Features
• Six channels of EMI filtering with integrated ESD
protection
• 0.4mm pitch, 15-bump, 2.360mm x 1.053mm
footprint Chip Scale Package (CSP)
• Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
• ±15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
• ±30kV ESD protection on each channel (HBM)
• Greater than 30dB attenuation (typical) at 1 GHz
• RoHS-compliant, lead-free packaging
Applications
• LCD and camera data lines in mobile handsets
• I/O port protection for mobile handsets, notebook
computers, PDAs etc.
• EMI filtering for data ports in cell phones, PDAs or
notebook computers.
• Wireless handsets
• Handheld PCs/PDAs
• LCD and camera modules
Functional Description
The CM1442-06LP is part of a family of pi-style EMI filter
arrays with ESD protection, which integrates six filters (C-
R-C) in a Chip Scale Package (CSP) form factor with
0.40mm pitch. The CM1442-06LP (low profile) has
component values of 15pF-100Ω-15pF per channel. The
CM1442-06LP has a cut-off frequency of 120MHz and can
be used in applications where the data rates are as high as
48Mbps. The parts include avalanche-type ESD diodes on
every pin, which provide a very high level of protection for
sensitive electronic components against potential
electrostatic discharge (ESD). The ESD protection diodes
safely dissipate ESD strikes of ±15kV, well beyond the
maximum requirement of the IEC61000-4-2 international
standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the pins
are protected for contact discharges at greater than ±30kV.
The CM1442-06LP is available in a space-saving, low-
profile CSP with RoHS-compliant, lead-free finishing. It is
manufactured with a 0.40mm pitch and 0.15mm CSP
solder ball to provide up to 28% board space saving versus
competing CSP devices with 0.50mm pitch and 0.30mm
CSP solder ball.
Package/Pinout Diagrams
©2010 SCILLC. All rights reserved.
March 2010 Rev. 3
Publication Order Number:
CM1442-06LP/D