CM1402_11 Datasheet, PDF (1/8 Pages) ON Semiconductor – SIM Card EMI Filter Array ESD Protection

CM1402
SIM Card EMI Filter Array
with ESD Protection
Product Description
The CM1402 is an EMI filter array with ESD protection, which
integrates three pi filters (C−R−C) and two additional channels of ESD
protection. The CM1402 has component values of 20 pF − 47 W −
20 pF, and 20 pF − 100 W − 20 pF. The parts include avalanche−type
ESD diodes on every pin, which provide a very high level of
protection for sensitive electronic components that may be subjected
to electrostatic discharge (ESD). The ESD diodes connected to the
filter ports are designed and characterized to safely dissipate ESD
strikes of ±10 kV, beyond the maximum requirement of the IEC
61000−4−2 international standard. Using the MIL−STD−883 (Method
3015) specification for Human Body Model (HBM) ESD, the pins are
protected for contact discharges at greater than ±25 kV.
The ESD diodes on pins A4 and C4 ports are designed and
characterized to safely dissipate ESD strikes of ±10 kV, well beyond
the maximum requirement of the IEC 61000−4−2 international
standard.
This device is particularly well suited for portable electronics (e.g.
mobile handsets, PDAs, notebook computers) because of its small
package format and easy−to−use pin assignments. In particular, the
CM1402 is ideal for EMI filtering and protecting data lines from ESD
for the SIM card slot in mobile handsets.
The CM1402 incorporates OptiGuardt coating which results in
improved reliability at assembly. The CM1402 is available in a
space−saving, low−profile Chip Scale Package.
Features
• Functionally and Pin−Compatible with CSPEMI400 Device
• OptiGuardt Coated for Improved Reliability at Assembly
• Three Channels of EMI Filtering, Each with ESD Protection
• Two Additional Channels of ESD−Only Protection
• ±10 kV ESD Protection (IEC 61000−4−2, Contact Discharge) on
All Pins
• ±25 kV ESD Protection (HBM)
• Greater than 30 dB of Attenuation at 1 GHz
• 10−Bump, 1.960 mm x 1.330 mm Footprint Chip Scale Package
(CSP)
• Chip Scale Package Features Extremely Low Lead Inductance for
Optimum Filter and ESD Performance
• These Devices are Pb−Free and are RoHS Compliant
Applications
• SIM Card Slot in Mobile Handsets
• I/O Port Protection for Mobile Handsets, Notebook Computers,
PDAs, etc.
• EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook
Computers
http://onsemi.com
WLCSP10
CP SUFFIX
CASE 567BL
MARKING DIAGRAM
CE MG
G
CE
= CM1402−03CP
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
CM1402−03CP CSP−10 3500/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
March, 2011 − Rev. 4
Publication Order Number:
CM1402/D