CM1223_12 Datasheet, PDF (1/13 Pages) ON Semiconductor – Capacitance ESD Protection Arrays with Backdrive Protection

CM1223
Industry First Low
Capacitance ESD Protection
Arrays with Backdrive
Protection
Product Description
The CM1223 family of diode arrays has been designed to provide
http://onsemi.com
ESD protection for electronic components or subsystems requiring
minimal capacitive loading. These devices are ideal for protecting
systems with high data and clock rates or for circuits requiring low
capacitive loading. Each ESD channel consists of a pair of diodes in
series, which steer the positive or negative ESD current pulse to either
SOT23−5
SO SUFFIX
CASE 527AH
SOT23−6
SO SUFFIX
CASE 527AJ
the positive (V_P) or negative (V_N) supply rail. A Zener diode is
embedded between V_P and V_N, to absorb positive ESD strikes and
provide ESD protection for the V_P rail. An additional diode is
integrated to serve as backdrive current protection. The CM1223
protects against ESD pulses up to ±8 kV per the IEC 61000−4−2
standard. In addition, all pins are protected from contact discharges of
greater than ±15 kV as outlined by the MIL−STD−883D (Method
3015) specification for Human Body Model (HBM) ESD.
SOT−143
SR SUFFIX
CASE 318A
MSOP 10
MR SUFFIX
CASE 846AE
BLOCK DIAGRAM
These devices are particularly well−suited for protecting systems
using high−speed ports such as USB2.0, IEEE1394 (Firewire^®,
iLink™), serial ATA, DVI, HDMI and corresponding ports in
(see page 2)
MARKING DIAGRAM
removable storage, digital camcorders, DVD−RW drives, as well as
other applications where extremely low loading capacitance with ESD
protection are required in a small package footprint.
XXX MG
G
XXX MG
G
XXX MG
G
Features
1
• Two, Four, and Eight Channels of ESD Protection with Integrated
Backdrive Protection on all Lines
• Provides ESD Protection to IEC61000−4−2 Level 4:
±8 kV Contact Discharge & ±15 kV Air Discharge
SOT143−4
SOT23−6
MSOP−10
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
• Low Channel Input Capacitance of 1.0 pF (typical)
• Minimal Capacitance Change with Temperature and Voltage
• Channel I/O to GND Capacitance Difference of 0.02 pF Typical is
Ideal for Differential Signals
• Mutual Capacitance between Signal Pin and Adjacent Signal Pin at
0.11 pF (typical)
• Zener Diode Protects Supply Rail and Eliminates the Need for
ORDERING INFORMATION
Device
CM1223−02SO
CM1223−02SR
CM1223−04SO
Package
SOT23−5
(Pb−Free)
SOT143−4
(Pb−Free)
SOT23−6
Shipping
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
External Bypass Capacitors
(Pb−Free)
• Pin Compatible with CM1213−02, −04, and −08
• Each I/O Pin Can Withstand over 1000 ESD Strikes
• Available in SOT, and MSOP Packages
CM1223−04MR
CM1223−08MR
MSOP−10
(Pb−Free)
MSOP−10
(Pb−Free)
4000/Tape & Reel
4000/Tape & Reel
• These Devices are Pb−Free and are RoHS Compliant
Applications
• USB 2.0 Ports at 480 Mbps in Desktop PCs, Notebooks
and Peripherals
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
• UDI and Display Ports
• IEEE1394 Firewire^® Ports at 400 Mbps / 800 Mbps
• Serial ATA Ports in Desktop PCs and Hard Disk Drives
• DVI Ports, HDMI Ports in Notebooks, Set Top Boxes,
• PCI Express Ports
Digital TVs, LCD Displays
• General Purpose High−speed Data Line ESD Protection
© Semiconductor Components Industries, LLC, 2012
1
July, 2012 − Rev. 6
Publication Order Number:
CM1223/D