CM1220 Datasheet, PDF (1/10 Pages) California Micro Devices Corp – 4 and 8-Channel ESD Protection Arrays in CSP

4 and 8-Channel ESD Protection
Arrays in CSP
CM1220
Features
• Four and eight channels of ESD protection
• OptiGuard^TM coated for improved reliability
• ±15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
• ±30kV ESD protection on each channel (HBM)
• Chip Scale Package (CSP) features extremely low
lead inductance for optimum ESD protection
• 5 bump, 0.960mm X 1.330mm CSP footprint
for CM1220-04
• 10 bump, 1.960mm X 1.330mm CSP footprint
for CM1220-08
• RoHS-compliant, lead-free version packaging
Applications
• LCD and camera data lines in mobile handsets
• I/O port protection for mobile handsets, notebook
computers, PDAs, etc.
• Keypads and buttons
• Wireless handsets
• Handheld PCs/PDAs
• LCD and camera modules
Block Diagram
Functional Description
The CM1220 ESD protection arrays are available in four
and eight channel configurations. Each ESD channel
features a nominal capacitance of 14pF making the devices
ideal for protecting high speed I/O ports and LCD and
camera data lines without significantly affecting signal
integrity. The CM1220 integrates avalanche-type ESD
diodes on every channel, providing a very high level of
protection for sensitive electronic components that may be
subjected to electrostatic discharge (ESD). These diodes
safely dissipate ESD strikes of ±15kV, exceeding the
maximum requirement of the IEC61000-4-2 international
standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
CM1220 protect against contact discharges at greater than
±30kV.
These devices are particularly well-suited for portable
electronics (e.g. wireless handsets, PDAs, notebook
computers) because of their small package and easy-to-
use pin assignments. In particular, the CM1220 is ideal for
protecting high speed I/O ports and data and control lines
for the LCD display and camera interface in mobile
handsets.
The CM1220 incorporates CMD’s OptiGuard^TM coating for
improved reliability at assembly in a space-saving, low-
profile Chip Scale Package.
©2010 SCILLC. All rights reserved.
March 2010 – Rev.2
Publication Order Number:
CM1220/D