BSP19AT1G Datasheet, PDF (1/4 Pages) ON Semiconductor – NPN Silicon Expitaxial Transistor

BSP19AT1G
NPN Silicon Expitaxial
Transistor
This family of NPN Silicon Epitaxial transistors is designed for use
as a general purpose amplifier and in switching applications. The
device is housed in the SOT-223 package which is designed for
medium power surface mount applications.
Features
 High Voltage: V_(BR)CEO of 250 and 350 V
 The SOT-223 Package Can Be Soldered Using Wave or Reflow
 SOT-223 Package Ensures Level Mounting, Resulting in Improved
Thermal Conduction, and Allows Visual Inspection of Soldered Joints
 The Formed Leads Absorb Thermal Stress During Soldering,
Eliminating the Possibility of Damage to the Die
 PNP Complement is BSP16T1
 Moisture Sensitivity Level (MSL): 1
 ESD: Human Body Model (HBM) = 4 KV
Machine Model (MM) = 400 V
 These Devices are Pb--Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (T_C = 25C unless otherwise noted)
Rating
Symbol Value
Unit
Collector-Emitter Voltage (Open Base)
Collector-Base Voltage (Open Emitter)
Emitter-Base Voltage (Open Collector)
Collector Current (DC)
V_CEO
V_CBO
V_EBO
I_C
350
Vdc
400
Vdc
5.0
Vdc
100
mAdc
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Power Dissipation @ T_A = 25C
(Note 1)
Derate above 25C
P_D
0.8
W
6.4
mW/C
Thermal Resistance, Junction--to--Ambient R_θJA
156
C/W
Junction and Storage Temperature Range T_stg --65 to +150 C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum
recommended footprint.
http://onsemi.com
SOT--223 PACKAGE
NPN SILICON HIGH VOLTAGE
TRANSISTOR SURFACE MOUNT
COLLECTOR 2,4
BASE
1
EMITTER 3
4
1
2
3
CASE 318E
TO-261AA
STYLE 1
MARKING
DIAGRAM
4
Collector
1
Base
AYW
SP19A G
G
2
Collector
3
Emitter
A
= Assembly Location
Y
= Year
W
= Work Week
SP19A = Specific Device Code
G
= Pb--Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
BSP19AT1G
SOT--223 1000 / Tape & Reel
(Pb--Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
 Semiconductor Components Industries, LLC, 2010
1
September, 2010 -- Rev. 8
Publication Order Number:
BSP19AT1/D