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BCP53-10T1G Datasheet, PDF (1/5 Pages) ON Semiconductor – PNP Silicon Epitaxial Transistors | |||
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BCP53 Series,
SBCP53 Series
PNP Silicon
Epitaxial Transistors
This PNP Silicon Epitaxial transistor is designed for use in audio
amplifier applications. The device is housed in the SOTâ223 package
which is designed for medium power surface mount applications.
⢠High Current: 1.5 A
⢠NPN Complement is BCP56
⢠The SOTâ223 Package can be soldered using wave or reflow. The
formed leads absorb thermal stress during soldering, eliminating the
possibility of damage to the die
⢠Device Marking:
BCP53T1 = AH
BCP53â10T1 = AHâ10
BCP53â16T1 = AHâ16
⢠AECâQ101 Qualified and PPAP Capable
⢠S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
⢠These Devices are PbâFree, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
CollectorâEmitter Voltage
CollectorâBase Voltage
EmitterâBase Voltage
Collector Current
Total Power Dissipation
@ TA = 25°C (Note 1.)
Derate above 25°C
VCEO
VCBO
VEBO
IC
PD
â80
Vdc
â100
Vdc
â5.0
Vdc
1.5
Adc
1.5
W
12
mW/°C
Operating and Storage
Temperature Range
TJ, Tstg
â65 to
°C
+150
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance,
Junction to Ambient
(surface mounted)
RqJA
83.3
°C/W
Lead Temperature for Soldering,
0.0625â³ from case
Time in Solder Bath
TL
260
°C
10
s
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in.
x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
© Semiconductor Components Industries, LLC, 2011
1
November, 2011 â Rev. 8
http://onsemi.com
MEDIUM POWER HIGH
CURRENT SURFACE MOUNT
PNP TRANSISTORS
COLLECTOR 2,4
BASE
1
EMITTER 3
MARKING DIAGRAM
SOTâ223
CASE 318E
STYLE 1
AYW
XXXXXG
G
1
A
= Assembly Location
Y
= Year
W
= Work Week
XXXXX = Specific Device Code
G
= PbâFree Package
(*Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shippingâ
BCP53T1G
SOTâ223
(PbâFree)
1000 / Tape &
Reel
SBCP53â10T1G SOTâ223
(PbâFree)
1000 / Tape &
Reel
BCP53â10T1G
SOTâ223
(PbâFree)
1000 / Tape &
Reel
SBCP53â10T1G SOTâ223
(PbâFree)
1000 / Tape &
Reel
BCP53â16T1G
SBCP53â16T1G
SOTâ223
(PbâFree)
SOTâ223
(PbâFree)
1000 / Tape &
Reel
1000 / Tape &
Reel
BCP53â16T3G
SOTâ223
(PbâFree)
4000 / Tape &
Reel
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
BCP53T1/D
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