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BAS20HT1_10 Datasheet, PDF (1/3 Pages) ON Semiconductor – High Voltage Switching Diode
BAS20HT1
High Voltage
Switching Diode
Features
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Continuous Reverse Voltage
VR
200
Repetitive Peak Reverse Voltage
VRRM
200
Continuous Forward Current
IF
200
Peak Forward Surge Current
IFM(surge)
625
Repetitive Peak Forward Current
IFRM
500
Non−Repetitive Peak Forward Current
IFSM
(Square Wave, TJ = 25°C prior to surge)
t = 1 ms
5.0
t = 1 ms
2.0
t=1s
0.5
Vdc
Vdc
mAdc
mAdc
mA
A
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR−5 Board*
PD
TA = 25°C
Derate above 25°C
200
mW
1.57
mW/°C
Thermal Resistance Junction−to−Ambient RqJA
635
°C/W
Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*FR−5 Minimum Pad
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol Min Max Unit
OFF CHARACTERISTICS
Reverse Voltage Leakage Current
(VR = 200 Vdc)
(VR = 200 Vdc, TJ = 150°C)
Reverse Breakdown Voltage
(IBR = 100 mAdc)
Forward Voltage
(IF = 100 mAdc)
(IF = 200 mAdc)
Diode Capacitance
(VR = 0, f = 1.0 MHz)
Reverse Recovery Time
(IF = IR = 30 mAdc, RL = 100 W)
IR
V(BR)
VF
CD
− 1.0 mAdc
− 100
250 −
Vdc
− 1000 mV
− 1250
− 5.0 pF
trr
− 50
ns
http://onsemi.com
HIGH VOLTAGE
SWITCHING DIODE
1
CATHODE
2
ANODE
2
1
SOD−323
CASE 477
STYLE 1
MARKING DIAGRAM
JR M G
G
JR = Specific Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending upon
manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping†
BAS20HT1G SOD−323
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2010
1
September, 2010 − Rev. 5
Publication Order Number:
BAS20HT1/D