PRTR5V0U2K Datasheet, PDF (9/12 Pages) NXP Semiconductors – Ultra low capacitance double rail-to-rail ESD protection

NXP Semiconductors
10. Soldering
PRTR5V0U2F; PRTR5V0U2K
Ultra low capacitance double rail-to-rail ESD protection
1.250
0.675
0.370
(6×)
0.270
(6×)
0.325
(6×)
0.500
1.700
0.500
0.425
(6×)
solder resist
solder paste = solderland
occupied area
Dimensions in mm
sot886_fr
Reflow soldering is the only recommended soldering method.
Fig 8. Reflow soldering footprint PRTR5V0U2F (SOT886)
1.05
1.4 0.7
0.5 0.6
(6×) (6×)
solder resist
solder land plus
solder paste
occupied area
Dimensions in mm
0.15
(6×)
0.25
0.35
(6×)
Reflow soldering is the only recommended soldering method.
Fig 9. Reflow soldering footprint PRTR5V0U2K (SOT891)
sot891_fr
PRTR5V0U2F_PRTR5V0U2K_1
Product data sheet
Rev. 01 — 6 November 2008
© NXP B.V. 2008. All rights reserved.
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