GTL2034 Datasheet, PDF (8/13 Pages) NXP Semiconductors – 4-bit GTL to GTL buffer

Philips Semiconductors
GTL2034
4-bit GTL to GTL buffer
13. Package outline
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
c
y
Z
14
8
E
A
X
H_E
vM A
pin 1 index
1
e
7
b_p
wM
A₂
A₁
Q
(A ₃)
A
θ
L_p
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A₁
A₂
A₃
b_p
c
D ⁽¹⁾ E ⁽²⁾
e
H_E
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT402-1
MO-153
L
L_p
Q
v
w
y
Z ⁽¹⁾ θ
1
0.75 0.4
0.50 0.3
0.2 0.13 0.1
0.72
0.38
8^o
0^o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 6. Package outline SOT402-1 (TSSOP14)
9397 750 13543
Product data sheet
Rev. 01 — 11 November 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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