GTL2034 Datasheet, PDF (11/13 Pages) NXP Semiconductors – 4-bit GTL to GTL buffer

Philips Semiconductors
GTL2034
4-bit GTL to GTL buffer
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
15. Abbreviations
Table 11: Abbreviations
Acronym
Description
CDM
Charged Device Model
ESD
ElectroStatic Discharge
GTL
Gunning Transceiver Logic
HBM
Human Body Model
MM
Machine Model
TTL
Transistor-Transistor Logic
16. Revision history
Table 12: Revision history
Document ID
Release date
GTL2034_1
20051111
Data sheet status
Product data sheet
Change notice Doc. number Supersedes
-
9397 750 13543 -
9397 750 13543
Product data sheet
Rev. 01 — 11 November 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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