PMEG3005EB Datasheet, PDF (7/10 Pages) NXP Semiconductors – 0.5 A very low VF MEGA Schottky barrier rectifiers

NXP Semiconductors
11. Soldering
PMEG3005EB; PMEG3005EL
0.5 A very low V_F MEGA Schottky barrier rectifiers
2.15
1.20
solder lands
solder paste
solder resist
occupied area
0.30
0.40
1.80
1.90
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 7. Reflow soldering footprint SOD523 (SC-79)
0.50 0.60
mgs343
R = 0.05 (8×)
1.30
0.30
R = 0.05 (8×)
0.90
0.60 0.70 0.80
(2×) (2×) (2×)
solder lands
0.30
(2×)
solder paste
0.40
(2×)
solder resist
0.50
(2×)
occupied area
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 8. Reflow soldering footprint SOD882
mbl872
PMEG3005EB_PMEG3005EL_1
Product data sheet
Rev. 01 — 29 November 2006
© NXP B.V. 2006. All rights reserved.
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