BLF4G22-100 Datasheet, PDF (7/14 Pages) NXP Semiconductors – UHF power LDMOS transistor

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50 mm
C1
V_G
R1
75 mm
L1
C2
C3
C4 L7
C5
C6
L6
C7
L2 L3
L4
L5
C13
C12
C11
C14
C15
L14
C8 C9 C10
L8
L9
C16
L10
L11
L13
L12
001aac276
The components are situated on double copper-clad Taconic RF35 Printed-Circuit Board (PCB) (ε_r = 3.5); thickness = 0.76 mm.
The other side is unetched and serves as a ground plane.
See Table 10 for list of components.
Fig 7. Component layout for 2.14 GHz test circuit