Z0109NN0 Datasheet, PDF (6/17 Pages) NXP Semiconductors – Logic level four-quadrant triac

NXP Semiconductors
Z0109NN0
4Q Triac
6. Thermal characteristics
Table 6.
Symbol
R_th(j-sp)
R_th(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to solder point
thermal resistance from
junction to ambient
Conditions
full cycle; see Figure 8
in free air; printed-circuit board mounted:
minimum footprint; full cycle; see Figure 6
in free air; printed-circuit board mounted: pad
area; full cycle; see Figure 7
Min Typ Max Unit
-
-
15 K/W
-
156 -
K/W
-
70
-
K/W
3.8 min
1.5
min
1.5
min
(3×)
1.5
min
6.3
2.3
4.6
All dimensions are in mm
001aab508
Fig 6. Minimum footprint SOT223
36
18
60
4.6
4.5
9
10
7
15
50
001aab509
All dimensions are in mm
Printed circuit board:
FR4 epoxy glass (1.6 mm thick), copper laminate
(35 um thick)
Fig 7. Printed circuit board pad area: SOT223
Z0109NN0
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 10 May 2011
© NXP B.V. 2011. All rights reserved.
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