Z0103NN_11 Datasheet, PDF (6/15 Pages) NXP Semiconductors – Logic level four-quadrant triac

NXP Semiconductors
Z0103NN
4Q Triac
5. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter
Conditions
Min Typ Max Unit
R_th(j-sp)
thermal resistance from junction full cycle; see Figure 8
to solder point
-
-
15 K/W
R_th(j-a)
thermal resistance from junction full cycle; printed circuit board mounted: -
156 -
K/W
to ambient
minimum footprint; see Figure 6
full cycle; printed circuit board mounted: -
70
-
K/W
pad area; see Figure 7
3.8 min
1.5
min
1.5
min
(3×)
1.5
min
6.3
2.3
4.6
All dimensions are in mm
001aab508
Fig 6. Minimum footprint SOT223
36
18
60
4.6
4.5
9
10
7
15
50
001aab509
All dimensions are in mm
Printed circuit board:
FR4 epoxy glass (1.6 mm thick), copper laminate
(35 um thick)
Fig 7. Printed circuit board pad area: SOT223
Z0103NN
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 05 — 21 March 2011
© NXP B.V. 2011. All rights reserved.
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