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BTA312-600D Datasheet, PDF (6/14 Pages) NXP Semiconductors – 3Q Hi-Com Triac
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NXP Semiconductors
BTA312-600D
3Q Hi-Com Triac
5. Thermal characteristics
Table 5.
Symbol
Rth(j-mb)
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance
from junction to
mounting base
thermal resistance
from junction to
ambient
Conditions
full cycle; see Figure 6
half cycle; see Figure 6
in free air
Min Typ Max Unit
-
-
1.5 K/W
-
-
2
K/W
-
60 -
K/W
10
Zth(j-mb)
(K/W)
1
(1)
10−1
(2)
10−2
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P
10−3
10−5
10−4
10−3
10−2
10−1
tp
t
1
10
tp (s)
(1) Unidirectional (half cycle)
(2) Bidirectional (full cycle)
Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse duration
BTA312-600D
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 30 November 2010
© NXP B.V. 2010. All rights reserved.
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