BTA204S-1000C Datasheet, PDF (6/15 Pages) NXP Semiconductors – 3Q Hi-Com Triac High blocking voltage capability

NXP Semiconductors
BTA204S-1000C
3Q Hi-Com Triac
5. Thermal characteristics
Table 5.
Symbol
R_th(j-mb)
Thermal characteristics
Parameter
thermal resistance from junction to
mounting base
R_th(j-a)
thermal resistance from junction to
ambient
Conditions
full cycle; see Figure 6
half cycle; see Figure 6
in free air
Min Typ
-
-
-
-
[1]
-
75
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
Max Unit
3
K/W
3.7 K/W
-
K/W
10
Z_th(j-mb)
(K/W)
1
003aag087
(1)
(2)
10^-1
P
10^-2
10^-5
10^-4
10^-3
10^-2
10^-1
t_p
t
1
t_p (s)
10
Fig 6.
(1) Unidirectional (half cycle)
(2) Bidirectional (full cycle)
Transient thermal impedance from junction to mounting base as a function of pulse width
BTA204S-1000C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 6 June 2011
© NXP B.V. 2011. All rights reserved.
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