PCF2123_11 Datasheet, PDF (58/63 Pages) NXP Semiconductors – SPI Real time clock/calendar Time keeping application

NXP Semiconductors
Footprint information for reflow soldering of TSSOP14 package
PCF2123
SPI Real time clock/calendar
SOT402-1
Hx
Gx
P2
(0.125)
(0.125)
Hy Gy
C
D2 (4x)
P1
D1
Generic footprint pattern
Refer to the package outline drawing for actual layout
By Ay
solder land
occupied area
DIMENSIONS in mm
P1
P2
Ay
By
C
D1 D2 Gx Gy Hx Hy
0.650 0.750 7.200 4.500 1.350 0.400 0.600 4.950 5.300 5.800 7.450
sot402-1_fr
Fig 41. Footprint information for reflow soldering of SOT402-1 (TSSOP14) package of PCF2123TS/1
PCF2123
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 27 April 2011
© NXP B.V. 2011. All rights reserved.
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