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LPC2468_08 Datasheet, PDF (50/72 Pages) NXP Semiconductors – Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface
NXP Semiconductors
LPC2468
Fast communication chip
Table 7. Static characteristics …continued
Tamb = −40 °C to +85 °C for commercial applications, unless otherwise specified.
Symbol
Parameter
Conditions
Min
USB pins
IOZ
OFF-state output
0 V < VI < 3.3 V
-
current
VBUS
bus supply voltage
-
VDI
differential input
|(D+) − (D−)|
0.2
sensitivity voltage
VCM
differential common includes VDI range
0.8
mode voltage range
Vth(rs)se
single-ended receiver
0.8
switching threshold
voltage
VOL
LOW-level output
RL of 1.5 kΩ to 3.6 V
-
voltage for
low-/full-speed
VOH
HIGH-level output
RL of 15 kΩ to GND
2.8
voltage (driven) for
low-/full-speed
Ctrans
transceiver
pin to GND
-
capacitance
ZDRV
driver output
impedance for driver
which is not
high-speed capable
with 33 Ω series resistor;
steady state drive
[12] 36
Rpu
pull-up resistance
SoftConnect = ON
1.1
Typ[1]
-
-
-
-
-
Max
±10
5.25
-
2.5
2.0
-
0.18
-
3.5
-
20
-
44.1
-
1.9
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages
[2] The RTC typically fails when Vi(VBAT) drops below 1.6 V.
[3] Including voltage on outputs in 3-state mode.
[4] VDD(3V3) supply voltages must be present.
[5] 3-state outputs go into 3-state mode when VDD(3V3) is grounded.
[6] Please also see the errata note in errata sheet.
[7] Accounts for 100 mV voltage drop in all supply lines.
[8] Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[9] Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V.
[10] On pin VBAT.
[11] To VSSIO.
[12] Includes external resistors of 18 Ω ± 1 % on D+ and D−.
Unit
µA
V
V
V
V
V
V
pF
Ω
kΩ
LPC2468_4
Product data sheet
Rev. 04 — 17 October 2008
© NXP B.V. 2008. All rights reserved.
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