English
Language : 

PDTC143X Datasheet, PDF (5/12 Pages) NXP Semiconductors – NPN resistor-equipped transistors; R1 = 4.7 kW, R2 = 10 kW
NXP Semiconductors
PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 kΩ, R2 = 10 kΩ
6. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
thermal resistance from in free air
junction to ambient
SOT416
SOT490
SOT346
SOT883
SOT54
SOT23
SOT323
Min Typ
[1] -
-
[1][2] -
-
[1] -
-
[2][3] -
-
[1] -
-
[1] -
-
[1] -
-
Max
833
500
500
500
250
500
625
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 60 μm copper strip line, standard footprint.
7. Characteristics
Unit
K/W
K/W
K/W
K/W
K/W
K/W
K/W
Table 8. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
ICBO
collector-base cut-off VCB = 50 V; IE = 0 A
current
ICEO
IEBO
collector-emitter
cut-off current
emitter-base cut-off
current
VCE = 30 V; IB = 0 A
VCE = 30 V; IB = 0 A;
Tj = 150 °C
VEB = 5 V; IC = 0 A
hFE
VCEsat
DC current gain
collector-emitter
saturation voltage
VCE = 5 V; IC = 10 mA
IC = 10 mA; IB = 0.5 mA
VI(off)
VI(on)
R1
off-state input voltage
on-state input voltage
bias resistor 1 (input)
VCE = 5 V; IC = 100 μA
VCE = 300 mV; IC = 20 mA
R2/R1 bias resistor ratio
Cc
collector capacitance VCB = 10 V; IE = ie = 0 A;
f = 1 MHz
Min Typ Max Unit
-
-
100 nA
-
-
1
μA
-
-
50 μA
-
-
600 μA
50 -
-
-
-
100 mV
-
-
0.3 V
2.5 -
-
V
3.3 4.7 6.1 kΩ
1.7 2.1 2.6
-
-
2.5 pF
PDTC143X_SER_10
Product data sheet
Rev. 10 — 16 November 2009
© NXP B.V. 2009. All rights reserved.
5 of 12