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PDTA124X Datasheet, PDF (5/12 Pages) NXP Semiconductors – PNP resistor-equipped transistors; R1 = 22 kohm, R2 = 47 kohm
NXP Semiconductors
PDTA124X series
PNP resistor-equipped transistors; R1 = 22 kΩ, R2 = 47 kΩ
6. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
SOT416
SOT490
SOT346
SOT883
SOT54
SOT23
SOT323
Conditions
in free air
Min Typ Max Unit
[1] -
-
833 K/W
[1][2] -
-
500 K/W
[1] -
-
500 K/W
[2][3] -
-
500 K/W
[1] -
-
250 K/W
[1] -
-
500 K/W
[1] -
-
625 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint.
7. Characteristics
Table 8. Characteristics
Tamb = 25 °C unless otherwise specified
Symbol Parameter
Conditions
ICBO
collector-base cut-off
VCB = −50 V; IE = 0 A
current
ICEO
collector-emitter cut-off VCE = −30 V; IB = 0 A
current
VCE = −30 V; IB = 0 A;
Tj = 150 °C
IEBO
emitter-base cut-off
current
VEB = −5 V; IC = 0 A
hFE
VCEsat
VI(off)
VI(on)
R1
DC current gain
collector-emitter
saturation voltage
off-state input voltage
on-state input voltage
bias resistor 1 (input)
VCE = −5 V; IC = −5 mA
IC = −10 mA;
IB = −0.5 mA
VCE = −5 V; IC = −100 µA
VCE = −0.3 V; IC = −2 mA
R2/R1 bias resistor ratio
Cc
collector capacitance
VCB = −10 V; IE = ie = 0 A;
f = 1 MHz
Min Typ Max Unit
-
-
−100 nA
-
-
−1 µA
-
-
−50 µA
-
-
−120 µA
80 -
-
-
-
−150 mV
-
−0.8 −0.5 V
−2 −1.1 -
V
15.4 22 28.6 kΩ
1.7 2.1 2.6
-
-
3
pF
PDTA124X_SER_8
Product data sheet
Rev. 08 — 3 September 2009
© NXP B.V. 2009. All rights reserved.
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