BTA208S-600B_11 Datasheet, PDF (5/13 Pages) NXP Semiconductors – 3Q Hi-Com Triac Triggering in three quadrants only

NXP Semiconductors
5. Thermal characteristics
Table 5.
Symbol
R_th(j-mb)
R_th(j-a)
Thermal characteristics
Parameter
thermal resistance
from junction to
mounting base
thermal resistance
from junction to
ambient
Conditions
full cycle; see Figure 6
half cycle; see Figure 6
in free air; printed circuit board (FR4)
mounted
10
Z_th(j-mb)
(K/W)
1
10^−1
unidirectional
bidirectional
BTA208S-600B
3Q Hi-Com Triac
Min Typ Max Unit
-
-
2
K/W
-
-
2.4 K/W
-
75
-
K/W
003aaf584
P
10^−2
10^−5
10^−4
10^−3
10^−2
10^−1
tp
t
1
10
t_p (s)
Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width
BTA208S-600B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 13 April 2011
© NXP B.V. 2011. All rights reserved.
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