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| PCF8576C_10 Datasheet, PDF (44/57 Pages) NXP Semiconductors – Universal LCD driver for low multiplex rates | |||
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NXP Semiconductors
14. Bare die outline
Wire bond die; 56 bonding pads; 3.0 x 2.82 x 0.38 mm
D
34
C1
35
x00
y
PCF8576C
Universal LCD driver for low multiplex rates
21
20
e
X
E
(4)
PCF8576CU
A
50
C2
51
56 1
8
7F
Dimensions
0
0.5
scale
Unit
A
D
E
e(3) P1(1) P2(2) P3(1) P4(2)
max
0.610
mm nom 0.38 2.82 3.00
0.110 0.097 0.110 0.097
min
0.096
Note
1. Pad size
2. Passivation opening
3. Dimension not drawn to scale
4. Marking code: PC8576C-1
Outline
version
References
IEC
JEDEC
JEITA
PCF8576CU
1 mm
Fig 36. Bare die outline of PCF8576CU/F1
PCF8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 â 22 July 2010
P4 P3
P2
P1
detail X
European
projection
pcf8576cu_do
Issue date
29-06-02
© NXP B.V. 2010. All rights reserved.
44 of 57
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