PZUXBL Datasheet, PDF (4/13 Pages) NXP Semiconductors – Single Zener diodes

NXP Semiconductors
PZUxBL series
Single Zener diodes
6. Thermal characteristics
Table 6.
Symbol
R_th(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
R_th(j-sp)
thermal resistance from
junction to solder point
Conditions
in free air
Min Typ Max Unit
[1][2] _-
-
500 K/W
[1][3] _-
-
250 K/W
[4] _-
-
55 K/W
[1] Reflow soldering is the only recommended soldering method.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm².
[4] Soldering point of cathode tab.
7. Characteristics
Table 7. Characteristics
T_j = 25 °C unless otherwise specified.
Symbol Parameter
V_F
forward voltage
[1] Pulse test: t_p ≤ 300 µs; δ ≤ 0.02.
Conditions
I_F = 10 mA
I_F = 100 mA
Min Typ Max Unit
[1]
-
-
0.9 V
-
-
1.1 V
Table 8. Characteristics per type; PZU2.4BL to PZU5.6B2L
T_j = 25 °C unless otherwise specified.
PZUxxx Sel
Working
voltage
V_Z (V)
Differential resistance Reverse
r_dif (Ω)
current
I_R (µA)
I_Z = 5 mA I_Z = 0.5 mA I_Z = 5 mA
Min Max Max
Max
Max V_R (V)
2.4
B
2.3 2.6 1000
100
50
1
2.7
B
2.5 2.9 1000
100
20
1
B2 2.65 2.9
3.0
B
2.80 3.20 1000
95
10
1
B2 2.95 3.20
3.3
B
3.10 3.50 1000
95
5
1
B2 3.25 3.50
3.6
B
3.40 3.80 1000
90
5
1
B2 3.55 3.80
3.9
B
3.70 4.10 1000
90
3
1
B2 3.87 4.10
4.3
B
4.01 4.48 1000
90
3
1
B2 4.15 4.34
Temperature
coefficient
S_Z (mV/K)
I_Z = 5 mA
Typ
−1.6
−2.0
−2.1
−2.4
−2.4
−2.5
−2.5
Diode
capacitance
C_d (pF)^[1]
Non-repetitive
peak reverse
current
I_ZSM (A)^[2]
Max
Max
450
8
440
8
425
8
410
8
390
8
370
8
350
8
PZUXBL_SER_1
Product data sheet
Rev. 01 — 6 May 2008
© NXP B.V. 2008. All rights reserved.
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