TDA8933B Datasheet, PDF (39/42 Pages) NXP Semiconductors – Class D audio amplifier

NXP Semiconductors
TDA8933B
Class D audio amplifier
15. Package outline
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
SOT549-1
D
c
y
exposed die pad side
Z
Dh
32
17
E
A
X
HE
vM A
Eh
pin 1 index
1
e
A2
A1
16
wM
bp
(A3)
A
θ
L_p
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions).
UNIT
A
max.
A1
A2 A3 bp
c
D⁽¹⁾ Dh
E⁽²⁾ Eh
e HE
mm
1.1
0.15
0.05
0.95
0.85
0.25
0.30 0.20 11.1
0.19 0.09 10.9
5.1
4.9
6.2
6.0
3.6
3.4
0.65
8.3
7.9
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT549-1
REFERENCES
JEDEC
JEITA
MO-153
L Lp
v
w
y
Z
θ
1
0.75
0.50
0.2
0.1
0.1
0.78
0.48
8^o
0^o
EUROPEAN
PROJECTION
ISSUE DATE
03-04-07
05-11-02
Fig 36. Package outline SOT549-1 (HTSSOP32)
TDA8933B_1
Preliminary data sheet
Rev. 01 — 23 October 2008
© NXP B.V. 2008. All rights reserved.
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