UJA1075 Datasheet, PDF (30/53 Pages) NXP Semiconductors – High-speed CAN/LIN core system basis chip

NXP Semiconductors
8. Thermal characteristics
UJA1075
High-speed CAN/LIN core system basis chip
optional heatsink top layer
PCB copper area:
(bottom layer)
2 cm²
optional heatsink top layer
PCB copper area:
(bottom layer)
8 cm²
optional heatsink top layer
UJA1075_2
Product data sheet
015aaa137
Layout conditions for R_th(j-a) measurements: board finish thickness 1.6 mm ±10 %, double-layer
board, board dimensions 129 mm × 60 mm, board Material FR4, Cu thickness 0.070 mm, thermal
via separation 1.2 mm, thermal via diameter 0.3 mm ±0.08 mm, Cu thickness on vias 0.025 mm.
Optional heat sink top layer of 3.5 mm × 25 mm will reduce thermal resistance (see Figure 14).
Fig 13. HTSSOP PCB
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 27 May 2010
© NXP B.V. 2010. All rights reserved.
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