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BLF6G10L-40BRN Datasheet, PDF (3/13 Pages) NXP Semiconductors – Power LDMOS transistor
NXP Semiconductors
BLF6G10L-40BRN
Power LDMOS transistor
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
VDS
VGS
VGS(sense)
ID
Tstg
Tj
drain-source voltage
gate-source voltage
sense gate-source voltage
drain current
storage temperature
junction temperature
Min Max Unit
-
65 V
−0.5 +11 V
−0.5 +9 V
-
11
A
−65 +150 °C
-
200 °C
5. Thermal characteristics
Table 5.
Symbol
Rth(j-case)
Thermal characteristics
Parameter
thermal resistance from junction to case
6. Characteristics
Conditions
Tcase = 80 °C; PL = 2.5 W (CW)
Typ Unit
1.7 K/W
Table 6. Characteristics
Tj = 25 °C per section; unless otherwise specified.
Symbol Parameter
V(BR)DSS
VGS(th)
IDq
drain-source breakdown voltage
gate-source threshold voltage
quiescent drain current
IDSS
IDSX
IGSS
gfs
RDS(on)
drain leakage current
drain cut-off current
gate leakage current
forward transconductance
drain-source on-state resistance
Conditions
VGS = 0 V; ID = 0.5 mA
VDS = 10 V; ID = 59 mA
sense transistor: IDS = 8.2 mA,
VDS = 26.5 V; main transistor:
VDS = 28 V
VGS = 0 V; VDS = 28 V
VGS = VGS(th) + 3.75 V; VDS = 10 V
VGS = 11 V; VDS = 0 V
VDS = 10 V; ID = 2.9 A
VGS = VGS(th) + 3.75 V; ID = 2.1 A
Min Typ
65 -
1.4 1.9
280 360
Max Unit
-
V
2.4 V
420 mA
-
-
1.4 μA
8.8 10
-
A
-
-
140 nA
2.7 4.3 -
S
0.09 0.25 0.39 Ω
BLF6G10L-40BRN
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 9 August 2010
© NXP B.V. 2010. All rights reserved.
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