SC18IS600 Datasheet, PDF (27/30 Pages) NXP Semiconductors – SPI to IC-bus interface

NXP Semiconductors
SC18IS600/601
SPI to I²C-bus interface
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 30. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
12. Abbreviations
Table 17. Abbreviations
Acronym
Description
ASCII
American Standard Code for Information Interchange
CPU
Central Processing Unit
GPIO
General Purpose Input/Output
I/O
Input/Output
I²C-bus
Inter-Integrated Circuit bus
LSB
Least Significant Bit
MSB
Most Significant Bit
PCB
Printed-Circuit Board
SPI
Serial Peripheral Interface
UART
Universal Asynchronous Receiver/Transmitter
SC18IS600_601_5
Product data sheet
Rev. 05 — 28 July 2008
© NXP B.V. 2008. All rights reserved.
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