SA58672 Datasheet, PDF (22/27 Pages) NXP Semiconductors – 3.0 W mono class-D audio amplifier

NXP Semiconductors
SA58672
3.0 W mono class-D audio amplifier
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
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MSL: Moisture Sensitivity Level
Fig 18. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Soldering of WLCSP packages
15.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
15.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
15.3 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 19) than a PbSn process, thus
reducing the process window
SA58672_4
Product data sheet
Rev. 04 — 8 June 2009
© NXP B.V. 2009. All rights reserved.
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