SA58672 Datasheet, PDF (19/27 Pages) NXP Semiconductors – 3.0 W mono class-D audio amplifier

NXP Semiconductors
SA58672
3.0 W mono class-D audio amplifier
WLCSP9: wafer level chip-size package; 9 bumps; 1.66 x 1.71 x 0.6 mm
SA58672UK
D
bump A1
index area
AB
E
A₂
A
A₁
detail X
e₁
b
e
∅v M C A B
∅w M C
C
B
A
bump A1
1
2
3
index area
e
e₂
C
y
X
0
DIMENSIONS (mm are the original dimensions)
UNIT ^A
max
A₁
A₂
b
D
E
e
e₁
mm
0.64
0.26
0.22
0.38
0.34
0.34
0.30
1.69
1.63
1.74
1.68
0.5
1
1
scale
2 mm
e₂
v
w
y
1 0.15 0.05 0.08
OUTLINE
VERSION
IEC
SA58672UK
REFERENCES
JEDEC
JEITA
Fig 17. Package outline WLCSP9
SA58672_4
Product data sheet
Rev. 04 — 8 June 2009
EUROPEAN
PROJECTION
ISSUE DATE
08-06-12
© NXP B.V. 2009. All rights reserved.
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