PCA2002 Datasheet, PDF (22/25 Pages) NXP Semiconductors – 32 kHz watch circuit with programmable output period and pulse width

NXP Semiconductors
PCA2002
32 kHz watch circuit programmable output period and pulse width
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
13.3.4 Cleaning
Cleaning can be done after reflow soldering.
14. Abbreviations
Table 14. Abbreviations
Acronym
Description
HBM
Human Body Model
LSB
Least Significant Bit
MM
Machine Model
MSB
Most Significant Bit
OTP
One Time Programmable
PCA2002_5
Product data sheet
Rev. 05 — 11 November 2008
© NXP B.V. 2008. All rights reserved.
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