BUK754R3-40B Datasheet, PDF (2/15 Pages) NXP Semiconductors – TrenchMOS standard level FET

Philips Semiconductors
BUK75/764R3-40B
TrenchMOS™ standard level FET
3. Limiting values
Table 2: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
V_DS
V_DGR
V_GS
I_D
drain-source voltage (DC)
drain-gate voltage (DC)
gate-source voltage (DC)
drain current (DC)
R_GS = 20 kΩ
T_mb = 25 °C; V_GS = 10 V;
Figure 2 and 3
I_DM
peak drain current
P_tot
total power dissipation
T_stg
storage temperature
T_j
junction temperature
Source-drain diode
I_DR
reverse drain current (DC)
T_mb = 100 °C; V_GS = 10 V; Figure 2
T_mb = 25 °C; pulsed; t_p ≤ 10 µs;
Figure 3
T_mb = 25 °C; Figure 1
T_mb = 25 °C
I_DRM
peak reverse drain current
Avalanche ruggedness
E_DS(AL)S non-repetitive drain-source avalanche
energy
T_mb = 25 °C; pulsed; t_p ≤ 10 µs
unclamped inductive load; I_D = 75 A;
V_DS ≤ 40 V; V_GS = 10 V; R_GS = 50 Ω;
starting T_mb = 25 °C
[1] Current is limited by power dissipation chip rating.
[2] Continuous current is limited by package.
Min
-
-
-
[1] _-
[2] _-
[2] _-
-
-
−55
−55
[1] _-
[2] _-
-
-
Max Unit
40
V
40
V
±20
V
176
A
75
A
75
A
706
A
254
W
+175 °C
+175 °C
176
A
75
A
706
A
961
mJ
9397 750 11133
Product data
Rev. 01 — 09 April 2003
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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