BCP52_13 Datasheet, PDF (16/22 Pages) NXP Semiconductors – 60 V, 1 A PNP medium power transistors

NXP Semiconductors
11. Soldering
BCP52; BCX52; BC52PA
60 V, 1 A PNP medium power transistors
1.3 1.2
(4×) (4×)
7
3.85
3.6
3.5
0.3
4
3.9 6.1 7.65
1
2
3
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
2.3
2.3
1.2
(3×)
1.3
(3×)
6.15
Fig 22. Reflow soldering footprint SOT223 (SC-73)
8.9
6.7
BCP52_BCX52_BC52PA
Product data sheet
1.9
4
6.2
8.7
1
2
3
1.9
(3×)
2.7
2.7
1.1
1.9
(2×)
Fig 23. Wave soldering footprint SOT223 (SC-73)
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 October 2011
sot223_fr
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot223_fw
© NXP B.V. 2011. All rights reserved.
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