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BAS70H.115 Datasheet, PDF (13/20 Pages) NXP Semiconductors – General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. | |||
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NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
4.4
4
2.9
1.6
2.1 1.6
1.1 1.2
1.1
(2Ã)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 19. Reflow soldering footprint SOD123F
solder lands
solder resist
solder paste
occupied area
R = 0.05 (8Ã)
1.30
0.30
R = 0.05 (8Ã)
0.90
0.60 0.70 0.80
(2Ã) (2Ã) (2Ã)
solder lands
0.30
(2Ã)
solder paste
0.40
(2Ã)
solder resist
0.50
(2Ã)
occupied area
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 20. Reflow soldering footprint SOD882
mbl872
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 â 13 January 2010
© NXP B.V. 2010. All rights reserved.
13 of 20
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